Abstract
Integrated circuit (IC) boards are ubiquitous in many of the products we utilize on a daily basis. The boards contain chips, resistors, capacitors, diodes, and other devices which make up the circuitry. These devices generate heat, and the materials used to construct the IC boards must withstand high temperatures. Some of the materials contain additives for fire prevention or have fire-retardant compounds incorporated into the polymer backbone.
For IC chips, epoxy molded compounds (EMC) are commonly used, as they are chemical resistant, absorb little moisture, and can withstand high temperatures. Polymers widely used for EMCs include phenolic epoxy resins, phenol/formaldehyde polymers (Novolacs), bismaleimides, and multiaromatic resins. These polymers also contain accelerators, fillers, curing agents, and antioxidants.
Keywords
Pyrolysis, plastics, integrated circuit board, gas chromatography, mass spectrometry
